iA Networks Company Limited is engaged in providing packaging and test services in CMOS image sensor devices. The company offers patented services including fluxless soldering, flip chip bonding, Transient Liquid Phase (TLP) bonding, Closed Loop Sealing, Stress Buffer Layer (SBL), etc. OptoPAC Inc. offers its services through patented NeoPAC product and NeoPAC Applications. The company is based in Cheongju, Chungcheongbuk-do Province, South Korea. OptoPAC Inc. was established in 2003.
Headquarters
114 Gwahaksaneop 1-Ro, Oksan-Myeon, Heungdeok-Gu
Cheongju; Chungcheongbuk;
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Website: http://www.optopac.com
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