Taiwan

Chipbond Technology Corporation (颀邦科技)

An EMIS Company Report EMIS is a Euromoney Institutional Investor plc company USD 29.95 Industry: Architectural, Engineering, and Related Services Available in: English & Chinese Format: PDF Download Most recent financial data: 2012 Buy full report

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This report extracts all available information about Chipbond Technology Corporation from EMIS' database of company information. The Table of Contents on the right indicates the categories of information that will be included in your report upon purchase.

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Contact Information

Headquarters
3, Li Hsin 5th Rd., SBIP, Hsinchu, Taiwan
Hsinchu County; Hsinchu County; Map

Tel: 886-3-567
Fax: 886-3-563

Company Description
Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant. The manufacturing process for driver ICs are different from the standard ICs; they are required to be manufactured by front end foundries' special process, then go through backend production by gold bumping, TCP or COF assembly process. Finally, they are sent to panel houses for final production. In recent years, Taiwan has invested more than 100 billion NTD into the photonics industry in development of TFT-LCD panels and related components. The industry has grown on a phenomenal scale and became the world leader overtaking South Korea. As gold bumping providers are losing its profitability and survivability, Driver IC assembly industries are bound for consolidation. Thus Chipbond with its turnkey service will maintain the leading position in Driver IC assembly market, sustaining steady growth
NAICS Industry Classification
Main Activities: Architectural, Engineering, and Related Services | Semiconductor and Other Electronic Component Manufacturing
Basic Information
Total Employees:
6,179 (2017)
Outstanding Shares:
: ()
Financial Auditors:
()
Incorporation Date:
July 02, 1997
Profile Updated:
December 15, 2017
Key Executives
Chairman of the Board of Directors
President
Spokesperson
Ownership Details
Wu Fei Chien
1.58%
More
Key Financial Highlights
2017 Q3C
Net sales revenue
Total operating revenue
Operating profit (EBIT)
EBITDA
Net Profit (Loss) for the Period
Total assets 34,360,610
Total equity
Operating Profit (EBIT) Margin
Return on Sales (ROS)
Return on Equity (ROE)
Debt to Equity
Quick Ratio
Cash Ratio
Note: units in Thousands. Statement: Audited, Consolidated
Source: Taiwan Economic Journal, EMIS Company Database.
Financial Performance Charts
Top Competitors

Financial Statements

Annual Statements

EMIS Credit Analytics

EMIS Benchmark Score

Latest News (Not included in the report)

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