Powertech Technology Inc. is primarily engaged in the provision of IC backend services. It offers services such as packaging of thin small-outline package (TSOP) ICs, quad flat no-lead (QFN) packaging, multi-chip package (MCP) packaging, stacked multi-chip package (S-MCP) packaging, ball grid array (BGA) ICs packaging, package on package (POP) assembly services, as well as memory card packaging, among others. In addition, it is involved in the ICs testing services and wafer testing services. The Company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
No.10, Datong Rd., hsinchu Ind. Park, Hukou Shiang, Hsinchu, Taiwan
Hsinchu County; Hsinchu County;
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