Innox Corporation is engaged in manufacturing of IT materials, semiconductor fields, packaging and FPCB materials. The company operates in three business divisions: Circuit materials business is engaged in manufacturing coverlay, bonging sheet, 2L,3L FCCL, EMI absorber, EMI shield and stiffener used in smartphones, tablets, notebooks and automobiles; Semiconductor materials business is engaged in manufacturing adhesive materials used for semiconductor packaging processing; and OLED materials business is engaged in manufacturing materials for next generation displays such as organic light emitting diodes. Innox Corporation is based in Asan, South Korea. The company was incorporated in 2001.
Headquarters
1352, Seokgok-Ri, Dunpo-Myeon, Asan-Si
Asan; Chungcheongnam;
Postal Code: 336-871
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Website: http://www.innoxcorp.com
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