Tsic Berhad (Malaysia)

The Company was incorporated in Malaysia on 19 September 2023 under the Act as a private limited company under the name of TSiC Sdn Bhd, for the purpose of being an investment holding company and the listing vehicle to facilitate the Proposed Listing. Subsequently, the Company was converted into a public limited company under the name of TSiC Berhad on 19 June 2024.
Our Group is principally involved in the repairing and replating of E E products, and general management consultancy services. In general, the business segments can be divided into 4 business activities, namely service contract activities, project activities, troubleshooting and repair activities as well as trading activities. The services related to the repairing and replating of E E products are part of the service contract activities, project activities as well as troubleshooting and repair activities, whilst the general management consultancy services are part of the service contract activities. The Group focus on semiconductor industry, providing on-site service support and headcount contract; PCB and mechanical design, fabrication and assembly; system integration; repair, replating and troubleshooting of PCBs and power supplies; as well as trading of components and parts. The Group do not have the in-house fabrication facility for PCB and mechanical parts, thus they outsource the PCB and mechanical fabrication works to their subcontractors.
In conjunction with, and as an integral part of the Proposed Listing, on 12 June 2024, the Company had entered into a share sale agreement with the Vendors of BPE Synergy Engineering Sdn. Bhd. (BPESE) to acquire the entire equity interest in BPESE. Our Company completed the Acquisition of BPESE on 21 June 2024.