Stats Chippac Ltd. is engaged in advanced semiconductor packaging design, assembly, test and distribution solutions. The company offers advanced packaging technology including fan-in and fan-out wafer level packaging, flip chip interconnect, 3D integration and Through Silicon Via (“TSV”). Stats Chippac also provides wafer probe and final testing on a diverse selection of test platforms used in semiconductors for mixed-signal, radio frequency, analog and high-performance digital devices. The company's headquarter is located in Singapore while it's manufacturing facilities are located in South Korea, Singapore, China, Malaysia and Taiwan.
Headquarters
5 Yishun Street 23, Singapore
Singapore; Singapore;
Postal Code: 768442
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