Chipbond Technology Corporation (颀邦科技股份有限公司) is based in Taiwan, China. The head office is in Hsinchu City. The company operates in the Semiconductor and Other Electronic Component Manufacturing sector. The company was established on July 02, 1997. 5,630 (2023) employees currently work for Chipbond Technology Corporation (颀邦科技股份有限公司). There was a net sales revenue increase of 5.49% reported in Chipbond Technology Corporation (颀邦科技股份有限公司)’s latest financial highlights for 2025. Its’ total assets recorded a growth of 4.24%. The net profit margin of Chipbond Technology Corporation (颀邦科技股份有限公司) decreased by 7.39% in 2025.
Headquarters
No 3,Li Hsin 5 Rd.,Science-Based Industrial Park
Hsinchu City; Hsinchu City;
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Website: http://www.chipbond.com.tw
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