Chipbond Technology Corporation (颀邦科技股份有限公司) is based in Taiwan, China. The head office is in Hsinchu City. The company operates in the Semiconductor and Other Electronic Component Manufacturing sector. The company was established on July 02, 1997. 5,630 (2023) employees currently work for Chipbond Technology Corporation (颀邦科技股份有限公司). There was a net sales revenue increase of 17.81% reported in Chipbond Technology Corporation (颀邦科技股份有限公司)’s latest financial highlights for Q2C2026. Its’ total assets recorded a growth of 26.44%. The net profit margin of Chipbond Technology Corporation (颀邦科技股份有限公司) increased by 0.94% in 2026.
Headquarters
No 3,Li Hsin 5 Rd.,Science-Based Industrial Park
Hsinchu City; Hsinchu City;
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Website: http://www.chipbond.com.tw
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