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Chipbond Technology Corporation (Taiwan, China)

Main Activities: Architectural, Engineering, and Related Services | Semiconductor and Other Electronic Component Manufacturing
Full name: Chipbond Technology Corporation Profile Updated: June 14, 2022
Buy our report for this company USD 29.95 Most recent financial data: 2021 Available in: English & Chinese Download a sample report

Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant. The manufacturing process for driver ICs are different from the standard ICs; they are required to be manufactured by front end foundries' special process, then go through backend production by gold bumping, TCP or COF assembly process. Finally, they are sent to panel houses for final production. In recent years, Taiwan has invested more than 100 billion NTD into the photonics industry in development of TFT-LCD panels and related components. The industry has grown on a phenomenal scale and became the world leader overtaking South Korea. As gold bumping providers are losing its profitability and survivability, Driver IC assembly industries are bound for consolidation. Thus Chipbond with its turnkey service will maintain the leading position in Driver IC assembly market, sustaining steady growth

Headquarters
3, Li Hsin 5th Rd., HsinChu Science Park, Hsinchu, Taiwan
Hsinchu County; Hsinchu County;

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Website: http://www.chipbond.com.tw

Basic Information
Total Employees:
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Outstanding Shares:
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Financial Auditors:
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Ratings:
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Incorporation Date:
July 02, 1997
Key Executives
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Chairman of the Board of Directors
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President
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Spokesperson
Ownership Details
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1.47%
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0.68%
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0.17%
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Subsidiaries
Chipmore Holding Company Limited
100%
International Semiconductor Technology Hol
35.56%
Orient Semiconductor Electroni
29.53%
Company Performance
Financial values in the chart are available after Chipbond Technology Corporation report is purchased.
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Key Financial Highlights
Annual growth percentages for latest two years in local currency TWD. Absolute financial data is included in the purchased report.
Net sales revenue
5.08%
Total operating revenue
5.08%
Operating profit (EBIT)
20.42%
EBITDA
27.17%
Net Profit (Loss) for the Period
41.46%
Total assets
20.69%
Total equity
26.32%
Operating Profit Margin (ROS)
3.28%
Net Profit Margin
6.57%
Return on Equity (ROE)
0.44%
Debt to Equity Ratio
-1.8%
Quick Ratio
0.33%
Cash Ratio
0.26%

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