Tong Hsing Electronic Industries, Ltd. (同欣电子工业股份有限公司) (Taiwan, China)

1. Established in 1974 Tong Hsing Electronic Industries, Ltd. initially issued its stock in 1999 and landed on GreTai in 2002. 2. Tong Hsing Electronic Industries, Ltd. is the manufacturer of niche integrated circuits for the modules in-Package (including high-frequency wireless communication module and hybrid integrated circuit module) and the ceramic circuit board. Its core technology is the manufacturing process of miniaturization of polycrystalline modules and the ceramic circuit board. 3. According to the MIC statistics, the global mobile phone shipments in 2006 was about 980 million, including GSM about 68.90%, CDMA about 27.7%. GSM Series are quad-band products, only one PA needed for the RF terminal. CDMA 3G generation mobile phone series contains on average two PA. So in 2006 global market size of about 1,251.46 million, Tong Hsing Electronic Industries, Ltd. accounted for 8.25%. Competitors ASE (Korea factory), Ling Sheng Precision, Hon Hai's China 3 ?, Yi Moke. 4. Favorable factor: Tong Hsing Electronic Industries, Ltd. said that micro-engineering and mechanical system obtained the exclusive certification, thick-film hybrid integrated circuit module and the ceramic circuit boards are beginning to be used in the auto electric area, and thin-film ceramic substrate LED DPC obtained the international patent process certification. 5. Unfavorable factors: as the linear IC - power amplifiers in the RF components within the handheld wireless communications products and RF front-end modules are mature products, domestic and international manufacturers provide similar service leading to the intense competition and declining price.