Advanced Assembly Materials (M) Sdn. Bhd. is the Malaysian manufacturing and operating subsidiary of Advanced Assembly Materials International Ltd., a global supplier of lead frames and advanced materials used in semiconductor packaging applications. The company is engaged in the production and supply of precision-engineered lead frames, diodes, transistors and related semiconductor assembly materials that are integral to integrated circuit packaging and electronic component manufacturing. Its operations support a wide range of semiconductor end markets, including consumer electronics, automotive electronics, industrial systems, communications infrastructure and computing devices. The company operates within Malaysia as part of a broader international manufacturing footprint that includes production facilities in China and sales and customer support functions across key Asia Pacific semiconductor hubs. Advanced Assembly Materials emphasizes high-precision manufacturing processes, stringent quality control systems and continuous materials innovation to meet evolving customer specifications and performance requirements. Its strategic orientation centers on long-term participation in the global semiconductor supply chain through scalable production capacity, process automation and close technical collaboration with customers. By aligning its capabilities with industry trends such as miniaturization, higher performance density and reliability enhancement, the company positions itself as a specialist materials supplier supporting advanced semiconductor packaging technologies.
Headquarters
Plo 534, Blok 1 & Blok 2, Jalan Keluli 3, Kawasan Perindustrian Pasir Gudang
Pasir Gudang; Johor;
Postal Code: 81700
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