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Powertech Technology Inc. (Taiwan)

Main Activities: Architectural, Engineering, and Related Services | Other Support Services
Full name: Powertech Technology Inc. Profile Updated: September 03, 2020
Buy our report for this company USD 29.95 Most recent financial data: 2019 Available in: English & Chinese Download a sample report

Powertech Technology Inc. is primarily engaged in the provision of IC backend services. It offers services such as packaging of thin small-outline package (TSOP) ICs, quad flat no-lead (QFN) packaging, multi-chip package (MCP) packaging, stacked multi-chip package (S-MCP) packaging, ball grid array (BGA) ICs packaging, package on package (POP) assembly services, as well as memory card packaging, among others. In addition, it is involved in the ICs testing services and wafer testing services. The Company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

Headquarters
No.10, Datong Rd., hsinchu Ind. Park, Hukou Shiang, Hsinchu, Taiwan
Hsinchu County; Hsinchu County;

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Website: http://www.pti.com.tw

Basic Information
Total Employees:
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Outstanding Shares:
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Financial Auditors:
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Incorporation Date:
May 15, 1997
Key Executives
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Chairman of the Board of Directors
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President
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Spokesperson
Ownership Details
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3.83%
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0.61%
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0.53%
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0.47%
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0.02%
Subsidiaries
Powertech Holding (BVI) Inc.
100%
Powertech Technology (Singapore) Pte.
100%
Powertech Technology Japan Limited Liabi
100%
Company Performance
Financial values in the chart are available after Powertech Technology Inc. report is purchased.
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Key Financial Highlights
Annual growth percentages for latest two years in local currency TWD. Absolute financial data is included in the purchased report.
Net sales revenue
29.51%
Total operating revenue
29.51%
Operating profit (EBIT)
70.88%
EBITDA
22.99%
Net Profit (Loss) for the Period
58.69%
Total assets
7.53%
Total equity
6.38%
Operating Profit Margin (ROS)
3.37%
Net Profit Margin
1.96%
Return on Equity (ROE)
2.47%
Debt to Equity Ratio
-4.55%
Quick Ratio
-0.31%
Cash Ratio
-0.3%

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